LSLT-160™ Low Shrink, Low Temperature Silicone
LSLT-160™ is designed to provide extremely
low shrink (.64%) and low 160°F
(71°C) cure capability, while
maintaining very high tear resistance. Molds can be made from Carved Ferris waxes
without special pre-treatment with any kind of release agent. Use Teflon spray
with resin models. Do not use with 3-D Systems, Inc. Invision resin models. Use
Akron Silicone RTV-RP for Invision models.
a high affinity for aluminum and stainless steel mold plates, each box contains
a supply of reusable heat resistant release paper. Do not attempt to vulcanize
LSLT-160 without using the release liners, as the mold will adhere to the
plates. As an alternative you can use our Teflon spray, if you wish. To ensure
ease of mold removal, spray the inner edges of the mold frame. Do not use
silicone spray as it will retard the cure.
1) Use the heat resistant release
paper as a base for your mold. Simply lay the paper on the mold plate under the
mold frame. This paper will prevent the rubber from adhering to the mold plate.
2) Cut enough rubber to fill the
mold frame to about ½ full. Work in with your fingers or a blunt tool. Carefully
place pieces or rubber within undercuts and delicate sections of the wax model.
3) Lay the wax model in place and
gently fill all voids with pieces of rubber. Carefully cut and place rubber
around and over the model. Work in gently with a blunt tool, making sure to
over-pack the frame slightly. Remember that if you do not place enough rubber
in the frame you will have voids and sponge like holes in your mold.
4) Place another piece of heat
resistant release paper on top of the mold frame. At low temperature settings
the parchment paper can be used many times.
5) Place the finished mold in your
pre-heated, carefully calibrated vulcanizer. Lower the platen and exert light
pressure slowly to prevent damage to the model. Wait a few minutes and tighten
a bit more. Do this several times until the vulcanizer is snug. Do not
over-tighten the vulcanizer. Rapid cool the mold in cold water, or let stand at
room temperature and cut.
Cure temperature and time for typical 19mm / ¾” mold frame
71°C/160°F for 90 minutes or 30 minutes per ¼” thickness
88°C/190°F for 30 minutes or 10 minutes per ¼” thickness
111°C/250°F and over for 15 minutes or 5 minutes per ¼”
Shrink rate is less than 1% (0.64%) for all
temperatures 40-42A Durometer